Keramiska substrategenskaper

◆Strong mechanical stress, stable shape; high strength, high thermal conductivity, high insulation; strong bonding force, anti-corrosion.

◆ Good thermal cycle performance, the number of cycles is up to 50,000 times, and the reliability is high.

◆Same as PCB board (or IMS substrate), it can etch out various pattern structures; no pollution and no pollution.

◆The operating temperature is -55 degree -850 degree ; the thermal expansion coefficient is close to silicon, which simplifies the production process of the power module.